Tuesday, November 17, 2009

Biodegradable, Implantable Circuitry

Modern implantable devices have two primary functions; to consistently and effectively execute the task they were built and programmed for, and to avoid rejection by human body. An advance in electrical materials technology has made the second objective far easier to obtain. Rather than “canning” the device within a rigid silicon shell to prevent an immune reaction, nanometer-sized circuitry too small to cause tissue irritation is applied to a dissolvable substrate.

Traditional biomedical devices require a rigid silicon shell to prevent direct contact between tissue and the electrical components. This design can be cumbersome, as each point of contact between device and human body must be carefully mediated to ensure the proper degree of isolation. A new design, boasting a thin deformable layer of silicon-silk and nanometer-sized silicon transistors, is about to sweep the biomedical field and perhaps reverse the nature of implantable devices.

To produce the material, scientists fabricate silicon transistors about 250 nanometers thick and one millimeter long onto a “stamp”, which is then transferred to a thin film of silk. With the addition of a saline solution, the stamp will conform to the surface of the tissue it is placed upon. Over time, the silk will dissolve, leaving behind a stable silicon framework directly incorporated into the tissue. No adverse side effects resulting from procedure have been reported, and silk is already approved by the FDA for implants, meaning commercial production of these devices could be right around the corner.

I found this article interesting because this procedure could result in a new generation of biomedical technology. The ability to directly apply circuitry onto tissue could augment existing electrical pathways or facilitate the production of trans-tissue diagnostic devices. For example, photonic “tattoos” could provide a constant readout of blood-sugar levels, eliminating the need for diabetic blood sampling.

Link: http://www.technologyreview.com/computing/23847/page1/#afteradbody

Scott Blasczyk, VTPP 434-502

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